Fluorous Metal Organic Frameworks and Nonporous Coordination Polymers as Low-κ Dielectrics, S. Galli (a), A. Cimino (a,b), J.F. Ivy (b), C. Giacobbe (c), R.K. Arvapally (b), R. Vismara (a),
S. Checchia (c), M.A. Rawshdeh (b), C.T. Cardenas (b), W.K. Yaseen (b), A. Maspero (a) and M.A. Omary (b), Adv. Funct. Mater. 29(40), 1904707 (2019); https://doi.org/10.1002/adfm.201904707.
(a) Università dell Insubria, Como (Italy) (b) University of North Texas, Denton (USA) (c) ESRF
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PRINCIPAL PUBLICATION AND AUTHORS
Fig. 139: a) Picture of the custom-made measurement setup. b) Schematic representation of the setup cell: the sample pellet was sandwiched between two coverslips coated with indium-tin oxide glass (sheet resistance 5 Ω sq−1) using conductive silver paint contacts. The cell sides were attached to a function generator (Fluke PM-5136); the applied voltage between the coverslips was measured via an oscilloscope.
alternate current of constant voltage (2 V) and different frequencies (in the 1 5×105 Hz range), employing a custom-made device (Figure 139). The results of these experiments unveiled that, in the essayed conditions, the structural features of the two compounds are not affected by the passage of an alternate current. As disclosed by whole powder pattern refinements, as a function of frequency, the unit cell parameters of FN-PCP-1 and FMOF-3 undergo negligible variations (less than ± 0.1%), well within experimental error. To support this qualitative observation, crystal structure refinements with the Rietveld method were carried out on selected data.
Bulk FN-PCP-1 and FMOF-3 are hydrophobic and have the effective κ value necessary for future chips. These results prompt further investigation of these two materials in functional forms (e.g., thin films) following this fundamental investigation of their basic structural, thermal and electrical properties in crystalline forms. This study demonstrates that fluorinated metal organic frameworks and fluorinated non- porous coordination polymers show a promising potential as low-κ materials, opening a new direction for the quest of promising candidates for low-κ dielectrics in microelectronic chip devices.